Our Solutions
IP+
Helping customer to success with outstanding IP
The Miles Corporation offers a comprehensive range of foundation IP(FIP) and complicated functional IP(CIP). FIP includes standard cell library, GPIO. Our FIP solution has some unique features and can be optimized based on applications, which enable leading PPA chip and shorter time to market. CIP offers customized IO designs including, LVDS IO, DDR IO, ONFI IO, as well as analog IP such as ADC, PLL, LDO, TIA, bandgap, Comparator and PVT Sensor etc. Such CIPs are very reliable and has extreme merit and can be customized in very short time. In addition, The Miles provides IP integration services, such as digital IP Hardening, enabling customers focus on system-level realization, plus consulting service for IP selection, PI/SI and IP protection. Based on our IP and IP service, Customer can produce leading PPA chip with reliability in shorter time.
Helping customer to success with outstanding IP
The Miles Corporation offers a comprehensive range of foundation IP(FIP) and complicated functional IP(CIP). FIP includes standard cell library, GPIO. Our FIP solution has some unique features and can be optimized based on applications, which enable leading PPA chip and shorter time to market. CIP offers customized IO designs including, LVDS IO, DDR IO, ONFI IO, as well as analog IP such as ADC, PLL, LDO, TIA, bandgap, Comparator and PVT Sensor etc. Such CIPs are very reliable and has extreme merit and can be customized in very short time. In addition, The Miles provides IP integration services, such as digital IP Hardening, enabling customers focus on system-level realization, plus consulting service for IP selection, PI/SI and IP protection. Based on our IP and IP service, Customer can produce leading PPA chip with reliability in shorter time.
Design Service+
The Miles has excellent design capabilities for global mainstream semiconductor processes including traditional CMOS and advanced FinFET technology.
Offering more flexible design services range from specification definitions to internal and third-party IP integration, verification, chip implementation. Our rich IP reserves and extensive third-party IP partnerships underscore our commitment to delivering excellent chip products for our customers
Supply Chain Management+
As Moore’s Law is no longer cost-efficient due to challenges of processes and tools. The next generation of industry applications is through Advanced-IC Packaging/ The Miles is conducting global professional resources to offer leading-edge global suppliers of integrated-circuit packaging and test solutions.
Our services include semiconductor manufacturing solutions; alternatives to design and manufacturing of the latest Systems-on-Chips (SoCs), using System-in-Package (SiP) and chipset-based approach
As Moore’s Law is no longer cost-efficient due to challenges of processes and tools. The next generation of industry applications is through Advanced-IC Packaging/ The Miles is conducting global professional resources to offer leading-edge global suppliers of integrated-circuit packaging and test solutions.
Our services include semiconductor manufacturing solutions; alternatives to design and manufacturing of the latest Systems-on-Chips (SoCs), using System-in-Package (SiP) and chipset-based approach
Please contact us
KBS Building A-1, 17-10 Higashi-Kanamachi 3-chome, Katsushika-ku, Tokyo, Japan
